Silicon carrier optoelectronic packaging
文献类型：专利
| 作者 | ANDRY, PAUL S.; BUDD, RUSSELL A.; DANG, BING; DANOVITCH, DAVID; FASANO, BENJAMIN V.; FORTIER, PAUL; GUERIN, LUC; LIBSCH, FRANK R.; OUIMET, SYLVAIN; PATEL, CHRIRAG S. |
| 发表日期 | 2012-12-27 |
| 专利号 | US20120326290A1 |
| 著作权人 | GLOBALFOUNDRIES INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Silicon carrier optoelectronic packaging |
| 英文摘要 | An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board. |
| 公开日期 | 2012-12-27 |
| 申请日期 | 2012-09-05 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54366]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | GLOBALFOUNDRIES INC. |
| 推荐引用方式 GB/T 7714 | ANDRY, PAUL S.,BUDD, RUSSELL A.,DANG, BING,et al. Silicon carrier optoelectronic packaging. US20120326290A1. 2012-12-27. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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