Light emitting diode package and method of manufacturing light emitting diode package
文献类型：专利
| 作者 | PARK, JIN SUNG; YOO, HO SANG; KWON, SANG BUM; LEE, KUM JUNG |
| 发表日期 | 2013-06-06 |
| 专利号 | WO2013081328A1 |
| 著作权人 | PARK, JIN SUNG |
| 国家 | 世界知识产权组织 |
| 文献子类 | 发明申请 |
| 其他题名 | Light emitting diode package and method of manufacturing light emitting diode package |
| 英文摘要 | A light emitting diode (LED) package having two vias (101, 102) and one epitaxial (epi) via (102) for electrical connections includes a carrier substrate (100), an LED chip, an epi layer (200), a bonding layer (110), two electrodes (210, 230), two conductors through the vias, two pads (250, 260) on the bottom of the carrier substrate and a passivation layer (240). The two vias are formed through the carrier substrate. The epi layer via is formed through the epi layer and the first electrode. Another LED package having a via and an epi layer via for electrical connections includes sub strate, an LED chip, an epi layer, a bonding layer, two electrodes, two conductors the via, two passivation layers (241, 242) for electrical insulation and two pads on the bottom of the carrier substrate. All electrical connections are formed through the single via and the epi layer via. The two conductors are isolated by the second passivation layer. A |
| 公开日期 | 2013-06-06 |
| 申请日期 | 2012-11-22 |
| 状态 | 未确认 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54386]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | PARK, JIN SUNG |
| 推荐引用方式 GB/T 7714 | PARK, JIN SUNG,YOO, HO SANG,KWON, SANG BUM,et al. Light emitting diode package and method of manufacturing light emitting diode package. WO2013081328A1. 2013-06-06. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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