Distributed cooling of arrayed semi conductor radiation emitting devices
文献类型：专利
| 作者 | KATZ JONATHAN M.; JOHNSON BENJAMIN D. |
| 发表日期 | 2014-04-18 |
| 专利号 | IN10087CHENP2012A |
| 著作权人 | PRESSCO IP LLC |
| 国家 | 印度 |
| 文献子类 | 发明申请 |
| 其他题名 | Distributed cooling of arrayed semi conductor radiation emitting devices |
| 英文摘要 | Techniques for the removal of waste heat from solid state semiconductor devices (such as cooking or heating devices) are provided. In particular techniques for conducting waste heat away from the device through a heat sink in contact with a cooling system are provided. In addition a multi head cooling system applicable to multiple solid state semiconductor sources is provided. |
| 公开日期 | 2014-04-18 |
| 申请日期 | 2012-11-30 |
| 状态 | 未确认 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54389]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | PRESSCO IP LLC |
| 推荐引用方式 GB/T 7714 | KATZ JONATHAN M.,JOHNSON BENJAMIN D.. Distributed cooling of arrayed semi conductor radiation emitting devices. IN10087CHENP2012A. 2014-04-18. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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