Electronic packaging substrate with etching indentation as die attachment anchor and method of manufacturing the same
文献类型：专利
| 作者 | LEE, MENG EE; ONG, ENG CHUAN; LIM, SEONG CHOON |
| 发表日期 | 2014-09-11 |
| 专利号 | US20140252399A1 |
| 著作权人 | AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Electronic packaging substrate with etching indentation as die attachment anchor and method of manufacturing the same |
| 英文摘要 | An electronics package is disclosed. The electronics package is disclosed as including a substrate core, a metal layer established on top of the substrate core, the metal layer being etched so as to include a die attachment anchor and at least one gap that separates a die bonding pad from at least one of a trace and wire bonding pad, for example. The die attachment anchor is established on top of the die bonding pad and has a depth that does not extend all the way through the die bonding pad. |
| 公开日期 | 2014-09-11 |
| 申请日期 | 2013-03-11 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54420]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED |
| 推荐引用方式 GB/T 7714 | LEE, MENG EE,ONG, ENG CHUAN,LIM, SEONG CHOON. Electronic packaging substrate with etching indentation as die attachment anchor and method of manufacturing the same. US20140252399A1. 2014-09-11. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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