Light source package and method of manufacturing the same
文献类型：专利
| 作者 | ABDUL KARIM, NORFIDATHUL AIZAR; LEE, CHIAU JIN; TAN, KHENG LENG |
| 发表日期 | 2014-12-04 |
| 专利号 | US20140353701A1 |
| 著作权人 | AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Light source package and method of manufacturing the same |
| 英文摘要 | A package for a light source is disclosed. In particular, a Plastic Leaded Chip Carrier (PLCC) is described which provides enhanced heat dissipating properties. Moreover, the PLCC is described as comprising a single-gage leadframe, which provides for enhanced design flexibility and reduced manufacturing costs. Methods of manufacturing light source packages are also disclosed. |
| 公开日期 | 2014-12-04 |
| 申请日期 | 2013-06-03 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54437]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED |
| 推荐引用方式 GB/T 7714 | ABDUL KARIM, NORFIDATHUL AIZAR,LEE, CHIAU JIN,TAN, KHENG LENG. Light source package and method of manufacturing the same. US20140353701A1. 2014-12-04. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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