Semiconductor package and method of manufacturing the same
文献类型：专利
| 作者 | KIM, DANIEL; YOU, JAE-SUNG; PARK, JONG-KIL |
| 发表日期 | 2013-11-28 |
| 专利号 | US20130316479A1 |
| 著作权人 | SAMSUNG ELECTRONICS CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor package and method of manufacturing the same |
| 英文摘要 | A light-emitting device package including a lead frame formed of a metal and on which a light-emitting device chip is mounted; and a mold frame coupled to the lead frame by injection molding. The lead frame includes: a mounting portion on which the light-emitting device chip is mounted; and first and second connection portions that are disposed on two sides of the mounting portion in a first direction and connected to the light-emitting device chip by wire bonding, wherein the first connection portion is stepped with respect to the mounting portion, and a stepped amount is less than a material thickness of the lead frame. |
| 公开日期 | 2013-11-28 |
| 申请日期 | 2013-08-07 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54445]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SAMSUNG ELECTRONICS CO., LTD. |
| 推荐引用方式 GB/T 7714 | KIM, DANIEL,YOU, JAE-SUNG,PARK, JONG-KIL. Semiconductor package and method of manufacturing the same. US20130316479A1. 2013-11-28. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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