中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Curable silicone composition, method for producing semiconductor device, and semiconductor device

文献类型:专利

作者YOSHIDA, HIROAKI; MIYAMOTO, YUSUKE; YOSHITAKE, MAKOTO; YOSHIDA, SHIN
发表日期2015-07-15
专利号EP2892946A2
著作权人DOW CORNING TORAY CO., LTD.
国家欧洲专利局
文献子类发明申请
其他题名Curable silicone composition, method for producing semiconductor device, and semiconductor device
英文摘要The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane composed of: (A-1) a linear organopolysiloxane having at least two silicon-bonded alkenyl groups in a molecule, and (A-2) a resin-like organopolysiloxane including 5 to 5.0% by weight alkenyl groups; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) a linear dialkyl polysiloxane having a viscosity at 25°C of 2 to 10 mm2/s and having alkenyl groups capping both molecular chain terminals; and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having low surface tackiness and a low coefficient of friction.
公开日期2015-07-15
申请日期2013-09-06
状态失效
源URL[http://ir.opt.ac.cn/handle/181661/54452]  
专题半导体激光器专利数据库
作者单位DOW CORNING TORAY CO., LTD.
推荐引用方式
GB/T 7714
YOSHIDA, HIROAKI,MIYAMOTO, YUSUKE,YOSHITAKE, MAKOTO,et al. Curable silicone composition, method for producing semiconductor device, and semiconductor device. EP2892946A2. 2015-07-15.

入库方式: OAI收割

来源:西安光学精密机械研究所

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