Encapsulating sheet-covered semiconductor element, producing method thereof, semiconductor device, and producing method thereof
文献类型：专利
| 作者 | KATAYAMA, HIROYUKI; KONDO, TAKASHI; EBE, YUKI; MITANI, MUNEHISA; OOYABU, YASUNARI |
| 发表日期 | 2014-04-09 |
| 专利号 | EP2717333A2 |
| 著作权人 | NITTO DENKO CORPORATION |
| 国家 | 欧洲专利局 |
| 文献子类 | 发明申请 |
| 其他题名 | Encapsulating sheet-covered semiconductor element, producing method thereof, semiconductor device, and producing method thereof |
| 英文摘要 | A method for producing an encapsulating sheet-covered semiconductor element includes a semiconductor element disposing step of disposing a plurality of semiconductor elements at spaced intervals to each other and an encapsulating sheet disposing step of disposing an encapsulating sheet so as to cover a plurality of the semiconductor elements and to form a space over the semiconductor elements adjacent to each other. |
| 公开日期 | 2014-04-09 |
| 申请日期 | 2013-10-02 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54454]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NITTO DENKO CORPORATION |
| 推荐引用方式 GB/T 7714 | KATAYAMA, HIROYUKI,KONDO, TAKASHI,EBE, YUKI,et al. Encapsulating sheet-covered semiconductor element, producing method thereof, semiconductor device, and producing method thereof. EP2717333A2. 2014-04-09. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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