Two Terminal Packaging
文献类型：专利
| 作者 | BILENKO, YURI; SHUR, MICHAEL; GASKA, REMIGIJUS |
| 发表日期 | 2014-04-24 |
| 专利号 | US20140110727A1 |
| 著作权人 | SENSOR ELECTRONIC TECHNOLOGY, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Two Terminal Packaging |
| 英文摘要 | A solution for packaging a two terminal device, such as a light emitting diode, is provided. In one embodiment, a method of packaging a two terminal device includes: patterning a metal sheet to include a plurality of openings; bonding at least one two terminal device to the metal sheet, wherein a first opening corresponds to a distance between a first contact and a second contact of the at least one two terminal device; and cutting the metal sheet around each of the least one two terminal device, wherein the metal sheet forms a first electrode to the first contact and a second electrode to the second contact. |
| 公开日期 | 2014-04-24 |
| 申请日期 | 2013-10-22 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54456]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SENSOR ELECTRONIC TECHNOLOGY, INC. |
| 推荐引用方式 GB/T 7714 | BILENKO, YURI,SHUR, MICHAEL,GASKA, REMIGIJUS. Two Terminal Packaging. US20140110727A1. 2014-04-24. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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