Light coupling formation in a waveguide layer
文献类型：专利
| 作者 | TSENG, CHUN-HAO; KUO, YING-HAO; YEE, KUO-CHUNG |
| 发表日期 | 2015-05-14 |
| 专利号 | US20150131938A1 |
| 著作权人 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Light coupling formation in a waveguide layer |
| 英文摘要 | An approach is provided for forming a light coupling in a waveguide layer. The approach involves forming a waveguide layer overlaying an upper surface of a substrate. The approach also involves placing a chip package portion within the waveguide layer in a selected position. The approach further involves forming a molding compound layer overlaying the waveguide layer and the chip package portion. The approach additionally involves curing the molding compound layer to form a cured package. The approach also involves releasing the cured package from the substrate and inverting the cured package. The approach further involves forming a ridge waveguide structure in the waveguide layer by removing a portion of the lower surface of the cured package. |
| 公开日期 | 2015-05-14 |
| 申请日期 | 2013-11-08 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54461]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 推荐引用方式 GB/T 7714 | TSENG, CHUN-HAO,KUO, YING-HAO,YEE, KUO-CHUNG. Light coupling formation in a waveguide layer. US20150131938A1. 2015-05-14. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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