Encapsulating sheet, optical semiconductor device, and producing method thereof
文献类型：专利
| 作者 | MATSUDA, HIROKAZU; ONA, HARUKA; OOYABU, YASUNARI |
| 发表日期 | 2014-06-04 |
| 专利号 | EP2738826A2 |
| 著作权人 | NITTO DENKO CORPORATION |
| 国家 | 欧洲专利局 |
| 文献子类 | 发明申请 |
| 其他题名 | Encapsulating sheet, optical semiconductor device, and producing method thereof |
| 英文摘要 | An encapsulating sheet, for encapsulating an optical semiconductor element mounted on a board by a wire-bonding connection, includes an embedding layer for embedding the optical semiconductor element and a wire and a cover layer covering the embedding layer. The embedding layer and the cover layer contain a catalyst containing a transition metal and are prepared from a silicone resin composition that is cured by accelerating a reaction by the catalyst. The ratio of the concentration of the transition metal in the cover layer to that of the transition metal in the embedding layer is 1 or more. The length from an interface between the embedding layer and the cover layer to a portion of the wire that is positioned closest to the cover layer-side is 150 µm or more. |
| 公开日期 | 2014-06-04 |
| 申请日期 | 2013-11-28 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54467]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NITTO DENKO CORPORATION |
| 推荐引用方式 GB/T 7714 | MATSUDA, HIROKAZU,ONA, HARUKA,OOYABU, YASUNARI. Encapsulating sheet, optical semiconductor device, and producing method thereof. EP2738826A2. 2014-06-04. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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