Method for manufacturing light emitting device package
文献类型：专利
| 作者 | CHO, MYONG-SOO; SON, MYEONG-RAK; SHIN, YOUNG-CHUL; LEE, SEUNG-HWAN |
| 发表日期 | 2014-07-31 |
| 专利号 | US20140213002A1 |
| 著作权人 | SAMSUNG ELECTRONICS CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Method for manufacturing light emitting device package |
| 英文摘要 | A method for manufacturing a light emitting device package is provided. In the method, a growth substrate including a plurality of light emitting devices disposed on a top surface of the growth substrate is prepared. A first package substrate having a bonding pattern corresponding to a portion of the plurality of light emitting devices is prepared, and the bonding pattern is disposed on a top surface of the first package substrate. The portion of the plurality of light emitting devices and the bonding pattern are bonded by disposing the top surface of the growth substrate to face the top surface of the first package substrate. The portion of the plurality of light emitting devices is separated from the growth substrate. The portion of the plurality of light emitting devices joined to the bonding pattern is packaged. |
| 公开日期 | 2014-07-31 |
| 申请日期 | 2014-01-24 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54488]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SAMSUNG ELECTRONICS CO., LTD. |
| 推荐引用方式 GB/T 7714 | CHO, MYONG-SOO,SON, MYEONG-RAK,SHIN, YOUNG-CHUL,et al. Method for manufacturing light emitting device package. US20140213002A1. 2014-07-31. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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