Flexible LED device with wire bond free die
文献类型：专利
| 作者 | PALANISWAMY, RAVI; JESUDOSS, AROKIARAJ; NARAG, ALEJANDRO ALDRIN II AGCAOILI; FOO, SIANG SIN; TAN, FONG LIANG; OUDERKIRK, ANDREW J.; MOONEY, JUSTINE A. |
| 发表日期 | 2016-02-18 |
| 专利号 | US20160049567A1 |
| 著作权人 | 3M INNOVATIVE PROPERTIES COMPANY |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Flexible LED device with wire bond free die |
| 英文摘要 | An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface. |
| 公开日期 | 2016-02-18 |
| 申请日期 | 2015-09-21 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54625]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | 3M INNOVATIVE PROPERTIES COMPANY |
| 推荐引用方式 GB/T 7714 | PALANISWAMY, RAVI,JESUDOSS, AROKIARAJ,NARAG, ALEJANDRO ALDRIN II AGCAOILI,et al. Flexible LED device with wire bond free die. US20160049567A1. 2016-02-18. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。