Flexible thermal ground plane and manufacturing the same
文献类型：专利
| 作者 | YANG, RONGGUI; LEE, YUNG-CHENG; BRIGHT, VICTOR M.; LI, CHEN ; OSHMAN, CHRISTOPHER; SHI, BO; CHENG, JEN-HAU; PETERSON, GEORGE P.
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| 发表日期 | 2016-06-30 |
| 专利号 | US20160187070A1 |
| 著作权人 | KELVIN THERMAL TECHNOLOGIES, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Flexible thermal ground plane and manufacturing the same |
| 英文摘要 | Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure. |
| 公开日期 | 2016-06-30 |
| 申请日期 | 2015-09-22 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54627]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | KELVIN THERMAL TECHNOLOGIES, INC. |
| 推荐引用方式 GB/T 7714 | YANG, RONGGUI,LEE, YUNG-CHENG,BRIGHT, VICTOR M.,et al. Flexible thermal ground plane and manufacturing the same. US20160187070A1. 2016-06-30. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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