Optoelectronic ball grid array package with fiber
文献类型：专利
| 作者 | DOERR, CHRISTOPHER |
| 发表日期 | 2016-05-05 |
| 专利号 | US20160124164A1 |
| 著作权人 | ACACIA COMMUNICATIONS, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Optoelectronic ball grid array package with fiber |
| 英文摘要 | A photonic integrated circuit may be coupled to an optical fiber and packaged. The optical fiber may be supported by a fiber holder during a solder reflow process performed to mount the packaged photonic integrated circuit to a circuit board or other substrate. The optical fiber may be decoupled from the fiber holder, and the fiber holder removed, after completion of the solder reflow process. |
| 公开日期 | 2016-05-05 |
| 申请日期 | 2015-10-29 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54637]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ACACIA COMMUNICATIONS, INC. |
| 推荐引用方式 GB/T 7714 | DOERR, CHRISTOPHER. Optoelectronic ball grid array package with fiber. US20160124164A1. 2016-05-05. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。