中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Optical transceiver having heat-dissipating path from assembly substrate directly to upper housing

文献类型:专利

作者ISHII, KUNIYUKI; KURASHIMA, HIROMI
发表日期2016-08-25
专利号US20160246019A1
著作权人SUMITOMO ELECTRIC INDUSTRIES, LTD.
国家美国
文献子类发明申请
其他题名Optical transceiver having heat-dissipating path from assembly substrate directly to upper housing
英文摘要A pluggable optical transceiver that enhances the heat dissipation function is disclosed. The optical transceiver provides the MPO connector that receives an external MT ferrule, the assembly substrate that installs a semiconductor optical device, a lens block that bends the optical axis of the semiconductor optical device by about 90°, the circuit board electrically connected to the assembly substrate, the inner fiber optically couples the WO connector with the lens block, and the top and bottom housings that installs the MPO connector, the assembly substrate, the circuit board, and the inner fiber therein. The bottom housing mounts the circuit board, while, the assembly substrate is thermally and physically in contact to the top housing through a thermal grease.
公开日期2016-08-25
申请日期2016-02-23
状态授权
源URL[http://ir.opt.ac.cn/handle/181661/54661]  
专题半导体激光器专利数据库
作者单位SUMITOMO ELECTRIC INDUSTRIES, LTD.
推荐引用方式
GB/T 7714
ISHII, KUNIYUKI,KURASHIMA, HIROMI. Optical transceiver having heat-dissipating path from assembly substrate directly to upper housing. US20160246019A1. 2016-08-25.

入库方式: OAI收割

来源:西安光学精密机械研究所

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