Optical transceiver by fowlp and dop multichip integration
文献类型：专利
| 作者 | DING, LIANG; NAGARAJAN, RADHAKRISHNAN L.; COCCIOLI, ROBERTO |
| 发表日期 | 2017-09-07 |
| 专利号 | US20170254968A1 |
| 著作权人 | INPHI CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Optical transceiver by fowlp and dop multichip integration |
| 英文摘要 | An optical transceiver by hybrid multichip integration. The optical transceiver includes a PCB with a plurality of prefabricated surface bonding sites. A first chip includes a FOWLP package of multiple electronics devices embedded in a dielectric molding layer overlying a dielectric redistribution layer is disposed on the PCB by respectively bonding a plurality of conductor balls between the dielectric redistribution layer and the plurality of prefabricated surface bonding sites while exposing soldering material filled in multiple through-mold vias (TMVs) in the dielectric molding layer. The optical transceiver further includes a second chip configured as a Sipho die comprising photonics devices embedded in a SOI wafer substantially free from any electronics device process. The second chip is stacked over the first chip with multiple conductor bumps being bonded respectively to the soldering material in the multiple TMVs. |
| 公开日期 | 2017-09-07 |
| 申请日期 | 2016-03-04 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54667]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INPHI CORPORATION |
| 推荐引用方式 GB/T 7714 | DING, LIANG,NAGARAJAN, RADHAKRISHNAN L.,COCCIOLI, ROBERTO. Optical transceiver by fowlp and dop multichip integration. US20170254968A1. 2017-09-07. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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