Light emitting diodes and methods with encapsulation
文献类型：专利
| 作者 | HUSSELL, CHRISTOPHER P.; ZHENYU, ZHONG |
| 发表日期 | 2016-10-06 |
| 专利号 | US20160293811A1 |
| 著作权人 | CREE, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Light emitting diodes and methods with encapsulation |
| 英文摘要 | Solid state lighting apparatuses, systems, and related methods are provided. An example apparatus can include one or more light emitting diodes (LEDs) and a dark or black encapsulation layer surrounding and/or disposed between the one or more LEDs. The apparatus can include, e.g., a substrate or a leadframe for mounting the LEDs. A method for producing a panel of LEDs can include joining the LEDs to the panel, e.g., by bump bonding, and flooding the panel with dark or black encapsulation material so that the LED chips are surrounded by the dark or black encapsulation material. |
| 公开日期 | 2016-10-06 |
| 申请日期 | 2016-03-31 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54681]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | CREE, INC. |
| 推荐引用方式 GB/T 7714 | HUSSELL, CHRISTOPHER P.,ZHENYU, ZHONG. Light emitting diodes and methods with encapsulation. US20160293811A1. 2016-10-06. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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