Integrated circuit packages including an optical redistribution layer
文献类型：专利
| 作者 | SEIDEMANN, GEORG; GEISSLER, CHRISTIAN; ALBERS, SVEN; WAGNER, THOMAS; DITTES, MARC; REINGRUBER, KLAUS; WOLTER, ANDREAS; PATTEN, RICHARD |
| 发表日期 | 2017-10-05 |
| 专利号 | US20170285280A1 |
| 著作权人 | INTEL IP CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Integrated circuit packages including an optical redistribution layer |
| 英文摘要 | Disclosed is a package comprising a substrate having a patterned surface with an optical contact area, an optical redistribution layer (oRDL) feature, and a build-up material extending over the patterned surface of the substrate and around portions of the oRDL features. In some embodiments, the package comprises a liner sheathing the oRDL features. In some embodiments, the oRDL feature extends through openings in an outer surface of the build-up material and forms posts extending outward from the outer surface. In some embodiments, the package comprises an electrical redistribution layer (eRDL) feature, at least some portion of which overlap at least some portion of the oRDL feature. In some embodiments, the package comprises an optical fiber coupled to the oRDL features. |
| 公开日期 | 2017-10-05 |
| 申请日期 | 2016-04-02 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54682]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INTEL IP CORPORATION |
| 推荐引用方式 GB/T 7714 | SEIDEMANN, GEORG,GEISSLER, CHRISTIAN,ALBERS, SVEN,et al. Integrated circuit packages including an optical redistribution layer. US20170285280A1. 2017-10-05. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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