Fiducial mark for chip bonding
文献类型：专利
| 作者 | FOO, SIANG SIN; KOSUGI, HIROMITSU; NARAG, ALEJANDRO ALDRIN II A.; PALANISWAMY, RAVI |
| 发表日期 | 2017-03-09 |
| 专利号 | WO2017040482A1 |
| 著作权人 | 3M INNOVATIVE PROPERTIES COMPANY |
| 国家 | 世界知识产权组织 |
| 文献子类 | 发明申请 |
| 其他题名 | Fiducial mark for chip bonding |
| 英文摘要 | A flexible multilayer construction (100) for mounting a light emitting semiconductor device (200) (LESD), includes a flexible dielectric substrate (110) having an LESD mounting region (120), first and second electrically conductive pads (130, 140) disposed in the LESD mounting region for electrically connecting to corresponding first and second electrically conductive terminals of an LESD (200) received in the LESD mounting region, and a first fiducial alignment mark (150) for an accurate placement of an LESD in the LESD mounting region. The first fiducial alignment mark is disposed within the LESD mounting region. |
| 公开日期 | 2017-03-09 |
| 申请日期 | 2016-08-30 |
| 状态 | 未确认 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54722]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | 3M INNOVATIVE PROPERTIES COMPANY |
| 推荐引用方式 GB/T 7714 | FOO, SIANG SIN,KOSUGI, HIROMITSU,NARAG, ALEJANDRO ALDRIN II A.,et al. Fiducial mark for chip bonding. WO2017040482A1. 2017-03-09. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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