Semiconductor package device and method of manufacturing the same
文献类型：专利
| 作者 | HO, HSIN-YING; CHAN, HSUN-WEI; LAI, LU-MING |
| 发表日期 | 2017-10-12 |
| 专利号 | US20170294564A1 |
| 著作权人 | ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor package device and method of manufacturing the same |
| 英文摘要 | A semiconductor package device includes an electronic device. The electronic device includes a first carrier, a first electronic component, a second carrier, a second electronic component, an encapsulant, and a lens. The first electronic component is disposed on the first carrier. The second carrier defines an aperture and is disposed on the first carrier. The aperture is positioned over the first electronic component and exposes the first electronic component. The second electronic component is disposed on the second carrier. The encapsulant covers the second electronic component. The lens defines a cavity and is disposed on the aperture of the first carrier. |
| 公开日期 | 2017-10-12 |
| 申请日期 | 2017-01-10 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54756]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
| 推荐引用方式 GB/T 7714 | HO, HSIN-YING,CHAN, HSUN-WEI,LAI, LU-MING. Semiconductor package device and method of manufacturing the same. US20170294564A1. 2017-10-12. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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