Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications
文献类型：专利
| 作者 | BUDD, RUSSELL A.; MEGHELLI, MOUNIR; ORCUTT, JASON SCOTT; PLOUCHART, JEAN-OLIVIER |
| 发表日期 | 2017-06-29 |
| 专利号 | US20170186739A1 |
| 著作权人 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications |
| 英文摘要 | Package structures and methods are provided to integrate optoelectronic and CMOS devices using SOI semiconductor substrates for photonics applications. For example, a package structure includes an integrated circuit (IC) chip, and an optoelectronics device and interposer mounted to the IC chip. The IC chip includes a SOI substrate having a buried oxide layer, an active silicon layer disposed adjacent to the buried oxide layer, and a BEOL structure formed over the active silicon layer. An optical waveguide structure is patterned from the active silicon layer of the IC chip. The optoelectronics device is mounted on the buried oxide layer in alignment with a portion of the optical waveguide structure to enable direct or adiabatic coupling between the optoelectronics device and the optical waveguide structure. The interposer is bonded to the BEOL structure, and includes at least one substrate having conductive vias and wiring to provide electrical connections to the BEOL structure. |
| 公开日期 | 2017-06-29 |
| 申请日期 | 2017-03-13 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54773]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 推荐引用方式 GB/T 7714 | BUDD, RUSSELL A.,MEGHELLI, MOUNIR,ORCUTT, JASON SCOTT,et al. Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications. US20170186739A1. 2017-06-29. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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