Multi-channel optical subassembly structure and method of packaging the structure
文献类型：专利
| 作者 | KIM, JEONG EUN; KANG, HYUN SEO; KIM, KEO SIK; KIM, SUNG CHANG; KIM, YOUNG SUN; RYU, JI HYOUNG; PARK, HYOUNG JUN; SON, DONG HOON; YEO, CHAN IL; HEO, YOUNG SOON |
| 发表日期 | 2018-04-12 |
| 专利号 | US20180100978A1 |
| 著作权人 | ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Multi-channel optical subassembly structure and method of packaging the structure |
| 英文摘要 | Provided are a multi-channel optical subassembly structure allowing an optical unit including a light source photodetector chip to be fixed through an alignment jig after active alignment is performed on an individual or single light source photodetector chip by using the alignment jig capable of electrical coupling and one electrode pad and the other electrode pad of a thermoelectric element, which are wire-bonded, capable of performing active alignment for each light source photodetector chip, that is, for each channel, capable of replacing the optical unit and the alignment jig when a problem occurs in some or all channels, capable of improving optical coupling efficiency for each channel, and capable of addressing a time-consuming and economically expensive work in which an optical subassembly is discarded when some channels fail, and a method of packaging the structure. |
| 公开日期 | 2018-04-12 |
| 申请日期 | 2017-04-28 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54784]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE |
| 推荐引用方式 GB/T 7714 | KIM, JEONG EUN,KANG, HYUN SEO,KIM, KEO SIK,et al. Multi-channel optical subassembly structure and method of packaging the structure. US20180100978A1. 2018-04-12. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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