Optical assemblies, interconnection substrates and methods for forming optical links in interconnection substrates
文献类型：专利
| 作者 | MASTERS, LEONARD THOMAS; MODAVIS, ROBERT ADAM; SUTHERLAND, JAMES SCOTT |
| 发表日期 | 2018-02-01 |
| 专利号 | WO2018022318A1 |
| 著作权人 | CORNING OPTICAL COMMUNICATIONS LLC |
| 国家 | 世界知识产权组织 |
| 文献子类 | 发明申请 |
| 其他题名 | Optical assemblies, interconnection substrates and methods for forming optical links in interconnection substrates |
| 英文摘要 | Optical assemblies, interconnection substrates and methods of forming optical links are disclosed. In one embodiment, an optical assembly includes a first waveguide substrate, a second waveguide substrate, and an interconnection substrate having a first end face, a second end face, and a laser written waveguide. The first waveguide substrate is coupled to the first end face of the interconnection substrate, and the first waveguide is optically coupled to the laser written waveguide. The laser written waveguide terminates at the second end face of the interconnection substrate. The second waveguide substrate is coupled to the second end face of the interconnection substrate such that the second waveguide is optically coupled to the laser written waveguide at the second end face. |
| 公开日期 | 2018-02-01 |
| 申请日期 | 2017-07-14 |
| 状态 | 未确认 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54801]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | CORNING OPTICAL COMMUNICATIONS LLC |
| 推荐引用方式 GB/T 7714 | MASTERS, LEONARD THOMAS,MODAVIS, ROBERT ADAM,SUTHERLAND, JAMES SCOTT. Optical assemblies, interconnection substrates and methods for forming optical links in interconnection substrates. WO2018022318A1. 2018-02-01. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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