Optical semiconductor package and method for manufacturing the same
文献类型：专利
| 作者 | WANG, CHUEI-TANG; CHANG, CHIH-CHIEH; LIAO, YU-KUANG; HSIA, HSING-KUO; CHANG, CHIH-YUAN; HSIEH, JENG-SHIEN; YU, CHEN-HUA |
| 发表日期 | 2019-05-02 |
| 专利号 | US20190131267A1 |
| 著作权人 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Optical semiconductor package and method for manufacturing the same |
| 英文摘要 | A semiconductor package includes an interconnect structure having a first surface and a second surface opposite to the first surface, at least one optical chip over the first surface of the interconnect structure and electrically coupled to the interconnect structure, an insulating layer contacting the second surface of the interconnect structure, and a molding compound over the first surface of the interconnect structure. The insulating layer includes a third surface facing the second surface of the interconnect structure and a fourth surface opposite to the third surface. At least an edge of the optical chip is covered by the molding compound. |
| 公开日期 | 2019-05-02 |
| 申请日期 | 2017-10-27 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54830]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 推荐引用方式 GB/T 7714 | WANG, CHUEI-TANG,CHANG, CHIH-CHIEH,LIAO, YU-KUANG,et al. Optical semiconductor package and method for manufacturing the same. US20190131267A1. 2019-05-02. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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