Packaged light emitting devices including electrode isolation structures and methods of forming packaged light emitting devices including the same
文献类型：专利
| 作者 | KANG, CHI-GOO; KIM, SUN-WOO; SONG, JONG-SUP; SONG, HO-YOUNG |
| 发表日期 | 2018-12-20 |
| 专利号 | US20180366615A1 |
| 著作权人 | SAMSUNG ELECTRONICS CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Packaged light emitting devices including electrode isolation structures and methods of forming packaged light emitting devices including the same |
| 英文摘要 | A packaged light emitting device can include a mounting substrate including first and second electrode portions that are separated by a recess defined by a first side surface of the first electrode portion and a second side surface of the second electrode portion that is opposite the first side surface. An insulation support member can partially fill a lower portion of the recess to partially cover the first side surface and partially cover the second side surface. A light emitting device can be coupled to the first and second electrode portions of the mounting substrate and a sealing member can be on the mounting substrate covering the light emitting device. |
| 公开日期 | 2018-12-20 |
| 申请日期 | 2017-12-14 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54838]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SAMSUNG ELECTRONICS CO., LTD. |
| 推荐引用方式 GB/T 7714 | KANG, CHI-GOO,KIM, SUN-WOO,SONG, JONG-SUP,et al. Packaged light emitting devices including electrode isolation structures and methods of forming packaged light emitting devices including the same. US20180366615A1. 2018-12-20. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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