Optical interconnection assemblies, glass interconnection substrates, and methods of making an optical connection
文献类型：专利
| 作者 | FLORIAN LOHSE, CHENUEH ABONGWA; SUTHERLAND, JAMES SCOTT |
| 发表日期 | 2018-08-30 |
| 专利号 | US20180246279A1 |
| 著作权人 | CORNING OPTICAL COMMUNICATIONS LLC |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Optical interconnection assemblies, glass interconnection substrates, and methods of making an optical connection |
| 英文摘要 | Optical interconnection assemblies, glass interconnection substrates, and methods for making optical connections are disclosed. In one embodiment, an optical interconnection assembly includes a base substrate, a substrate optical waveguide coupled to the base substrate, the substrate optical waveguide having an end surface, an optical chip comprising an optical coupling surface, and a glass interconnection substrate. The glass interconnection substrate includes a first end optically coupled to the end surface of the substrate optical waveguide, a second end optically coupled to the optical coupling surface of the optical chip, and a curved portion disposed between the first end and the second end. The glass interconnection substrate further includes an optical waveguide at least partially positioned within the curved portion. |
| 公开日期 | 2018-08-30 |
| 申请日期 | 2018-02-19 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54860]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | CORNING OPTICAL COMMUNICATIONS LLC |
| 推荐引用方式 GB/T 7714 | FLORIAN LOHSE, CHENUEH ABONGWA,SUTHERLAND, JAMES SCOTT. Optical interconnection assemblies, glass interconnection substrates, and methods of making an optical connection. US20180246279A1. 2018-08-30. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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