Optoelectronic integrated semiconductor module and method for manufacturing same
文献类型：专利
| 作者 | FURUYAMA, HIDETO |
| 发表日期 | 2019-04-25 |
| 专利号 | US20190123231A1 |
| 著作权人 | KABUSHIKI KAISHA TOSHIBA |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Optoelectronic integrated semiconductor module and method for manufacturing same |
| 英文摘要 | According to one embodiment, the electric interconnection layer includes a metal interconnection and an insulating film. The optical device is provided within the electric interconnection layer, and electrically connected to the metal interconnection. The optical device includes at least one of a light emitting element and a light receiving element. The optical waveguide is provided within the electric interconnection layer, and optically coupled to the optical device. The semiconductor devices are provided on a first face of the electric interconnection layer, and electrically connected to the metal interconnection. The resin seals the semiconductor devices. The external connection terminals are provided on a second face of the electric interconnection layer, and electrically connected to the metal interconnection. |
| 公开日期 | 2019-04-25 |
| 申请日期 | 2018-03-09 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54865]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | KABUSHIKI KAISHA TOSHIBA |
| 推荐引用方式 GB/T 7714 | FURUYAMA, HIDETO. Optoelectronic integrated semiconductor module and method for manufacturing same. US20190123231A1. 2019-04-25. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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