Photonic die fan out package with edge fiber coupling interface and related methods
文献类型：专利
| 作者 | RAMACHANDRAN, KOUSHIK; FASANO, BENJAMIN V.; BLACKSHEAR, EDMUND D. |
| 发表日期 | 2019-09-19 |
| 专利号 | US20190285804A1 |
| 著作权人 | GLOBALFOUNDRIES INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Photonic die fan out package with edge fiber coupling interface and related methods |
| 英文摘要 | A photonic integrated circuit (PIC) fan-out package and related methods of forming same are disclosed. The PIC fan-out package includes: an overmold body; a PIC die in the overmold body, the PIC die including electro-optic circuitry; a plurality of optical fiber stubs operatively coupled to the electro-optic circuitry; an edge fiber coupling interface in a lateral side of the overmold body for coupling the plurality of optical fiber stubs to external optical fibers using a connector; an ancillary device in the overmold body; a redistribution wiring layer (RDL) interposer adjacent the overmold body and electrically connected to the PIC die and the ancillary device; and a ball grid array (BGA) electrically coupled to the PIC die and the ancillary device by the RDL interposer, the BGA configured to electrically couple the PIC die and the ancillary device to a printed circuit board (PCB). |
| 公开日期 | 2019-09-19 |
| 申请日期 | 2018-03-14 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54869]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | GLOBALFOUNDRIES INC. |
| 推荐引用方式 GB/T 7714 | RAMACHANDRAN, KOUSHIK,FASANO, BENJAMIN V.,BLACKSHEAR, EDMUND D.. Photonic die fan out package with edge fiber coupling interface and related methods. US20190285804A1. 2019-09-19. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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