Electronic element mounting substrate, electronic device, and electronic module
文献类型：专利
| 作者 | KITAZUMI,NOBORU |
| 发表日期 | 2018-11-01 |
| 专利号 | WO2018199022A1 |
| 著作权人 | KYOCERA CORPORATION |
| 国家 | 世界知识产权组织 |
| 文献子类 | 发明申请 |
| 其他题名 | Electronic element mounting substrate, electronic device, and electronic module |
| 英文摘要 | An electronic element mounting substrate comprising: a rectangular substrate having a first major surface and a second major surface opposing the first major surface; and heat-dissipation bodies which are embedded in a row in the substrate, the heat-dissipation bodies being made from a carbon material and having a third major surface positioned on the first major surface side in a thickness direction and a fourth major surface opposing the third major surface. In a transparent plan view, the heat-dissipation bodies are more thermally conductive in a direction perpendicular to a direction of the row of the heat-dissipation bodies than in the direction of the row of the heat-dissipation bodies. |
| 公开日期 | 2018-11-01 |
| 申请日期 | 2018-04-23 |
| 状态 | 未确认 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54890]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | KYOCERA CORPORATION |
| 推荐引用方式 GB/T 7714 | KITAZUMI,NOBORU. Electronic element mounting substrate, electronic device, and electronic module. WO2018199022A1. 2018-11-01. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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