Fiber Encapsulation Mechanism for Energy Dissipation in a Fiber Amplifying System
文献类型:专利
作者 | FIDRIC, BERNARD; ROSENFELD, DANIEL; PARDHAN, RAHIM |
发表日期 | 2018-09-06 |
专利号 | US20180254594A1 |
著作权人 | WAYMO LLC |
国家 | 美国 |
文献子类 | 发明申请 |
其他题名 | Fiber Encapsulation Mechanism for Energy Dissipation in a Fiber Amplifying System |
英文摘要 | The present disclosure relates to a fiber encapsulation mechanism for energy dissipation in a fiber amplifying system. One example embodiment includes an optical fiber amplifier. The optical fiber amplifier includes an optical fiber that includes a gain medium, as well as a polymer layer that at least partially surrounds the optical fiber. The polymer layer is optically transparent. In addition, the optical fiber amplifier includes a pump source. Optical pumping by the pump source amplifies optical signals in the optical fiber and generates excess heat and excess photons. The optical fiber amplifier additionally includes a heatsink layer disposed adjacent to the polymer layer. The heatsink layer conducts the excess heat away from the optical fiber. Further, the optical fiber amplifier includes an optically transparent layer disposed adjacent to the polymer layer. The optically transparent layer transmits the excess photons away from the optical fiber. |
公开日期 | 2018-09-06 |
申请日期 | 2018-05-07 |
状态 | 申请中 |
源URL | [http://ir.opt.ac.cn/handle/181661/54893] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | WAYMO LLC |
推荐引用方式 GB/T 7714 | FIDRIC, BERNARD,ROSENFELD, DANIEL,PARDHAN, RAHIM. Fiber Encapsulation Mechanism for Energy Dissipation in a Fiber Amplifying System. US20180254594A1. 2018-09-06. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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