Light emitting device and light emitting device package
文献类型：专利
| 作者 | LIM, CHANG MAN; KIM, KI SEOK; KIM, YOUNG SHIN; SONG, JUNE O; OH, JU HYEON; LEE, CHANG HYEONG; LEE, TAE SUNG; JUNG, SE YEON; CHOI, BYUNG YEON; HWANG, SUNG MIN |
| 发表日期 | 2019-01-17 |
| 专利号 | US20190019929A1 |
| 著作权人 | LG INNOTEK CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Light emitting device and light emitting device package |
| 英文摘要 | The light emitting device package disclosed in the embodiment includes: first and second frames having first and second through holes; a body disposed between the first and second frames; a light emitting device including a first bonding pad and a second bonding pad; and a conductive part in the first and second through holes. wherein at least one of the first and second bonding pads faces the first and second frames and overlaps with the first and second through holes and includes a contact region contacting the conductive part and a first non-contact non-contacting the conducive part. |
| 公开日期 | 2019-01-17 |
| 申请日期 | 2018-07-13 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54907]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | LG INNOTEK CO., LTD. |
| 推荐引用方式 GB/T 7714 | LIM, CHANG MAN,KIM, KI SEOK,KIM, YOUNG SHIN,et al. Light emitting device and light emitting device package. US20190019929A1. 2019-01-17. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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