Adhesion Promoter Apparatus and Method
文献类型：专利
| 作者 | TSENG, CHUN-HAO; KUO, YING-HAO; CHENG, KAI-FANG; CHEN, HAI-CHING; BAO, TIEN-I |
| 发表日期 | 2019-01-24 |
| 专利号 | US20190025514A1 |
| 著作权人 | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Adhesion Promoter Apparatus and Method |
| 英文摘要 | An apparatus comprises a substrate having a plateau region and a trench region, a metal layer over the plateau region, a semiconductor component over the trench region, wherein a gap is between the plateau region and the semiconductor component, an adhesion promoter layer over the plateau region, the semiconductor component and the gap, a dielectric layer over the adhesion promoter layer and a bonding interface formed between the adhesion promoter layer and the dielectric layer, wherein the bonding interface comprises a chemical structure comprising a first dielectric material of the adhesion promoter layer and a second dielectric material of the dielectric layer. |
| 公开日期 | 2019-01-24 |
| 申请日期 | 2018-09-25 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54921]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 推荐引用方式 GB/T 7714 | TSENG, CHUN-HAO,KUO, YING-HAO,CHENG, KAI-FANG,et al. Adhesion Promoter Apparatus and Method. US20190025514A1. 2019-01-24. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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