Wafer-level optoelectronic packaging
文献类型：专利
| 作者 | LAM, YEE, LOY |
| 发表日期 | 2019-05-09 |
| 专利号 | WO2019086953A1 |
| 著作权人 | DENSELIGHT SEMICONDUCTORS PTE. LTD. |
| 国家 | 世界知识产权组织 |
| 文献子类 | 发明申请 |
| 其他题名 | Wafer-level optoelectronic packaging |
| 英文摘要 | A wafer-level optoelectronic packaging method includes fabricating a pre-singulated wafer. The pre-singulated wafer has a plurality of sub-mounts. A first sub-mount of the plurality of sub- mounts includes an optical waveguide formed on a substrate, a multi-layered sub-mount boundary wall that is formed on the optical waveguide, and a v-groove that is external to the sub- mount boundary wall. A plurality of optical dies are attached to the corresponding plurality of sub-mounts, such that each optical die is aligned to the optical waveguide of the corresponding sub-mount. A cap-wafer including a plurality of caps is attached to the pre-singulated wafer to obtain an encapsulated pre-singulated wafer. The encapsulated pre-singulated wafer is diced to obtain a plurality of optoelectronic packages. The optical waveguide of each optoelectronic package serves as an interconnection conduit between the corresponding optical die and an optical fiber placed in the corresponding v-groove. |
| 公开日期 | 2019-05-09 |
| 申请日期 | 2018-10-16 |
| 状态 | 未确认 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54927]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | DENSELIGHT SEMICONDUCTORS PTE. LTD. |
| 推荐引用方式 GB/T 7714 | LAM, YEE, LOY. Wafer-level optoelectronic packaging. WO2019086953A1. 2019-05-09. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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