Semiconductor device package and method of manufacturing the same
文献类型：专利
| 作者 | HO, HSIN-YING; CHAN, HSUN-WEI |
| 发表日期 | 2019-06-13 |
| 专利号 | US20190181311A1 |
| 著作权人 | ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor device package and method of manufacturing the same |
| 英文摘要 | A semiconductor device package is provided, which includes a carrier, an emitter and a first transparent encapsulant. The carrier has a first surface. The emitter is disposed on the first surface. The first transparent encapsulant encapsulates the emitter. The first transparent encapsulant includes a body and a lens portion. The body has a first planar surface. The lens portion is disposed on the body and has a first planar surface. The first planar surface of the lens portion is substantially coplanar with the first planar surface of the body. |
| 公开日期 | 2019-06-13 |
| 申请日期 | 2018-11-21 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54934]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
| 推荐引用方式 GB/T 7714 | HO, HSIN-YING,CHAN, HSUN-WEI. Semiconductor device package and method of manufacturing the same. US20190181311A1. 2019-06-13. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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