Integration of chip level micro-fluidic cooling in chip packages for heat flux removal
文献类型：专利
| 作者 | HARRIS, DANIEL W.; DITRI, JOHN; HAHN, JOSEPH W.; MCNULTY, MICHAEL K. |
| 发表日期 | 2019-06-13 |
| 专利号 | US20190181071A1 |
| 著作权人 | LOCKHEED MARTIN CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Integration of chip level micro-fluidic cooling in chip packages for heat flux removal |
| 英文摘要 | An electronic chip package includes a base defining a fluid inlet opening for receiving pressurized fluid from a fluid source and a fluid outlet opening. A dielectric body is arranged on the base and configured to support an electronic device. The dielectric body comprises a coolant flow chamber formed in a first surface thereof, and a plurality of impingement openings formed within the coolant flow chamber. The plurality of impingement openings are in communication with the fluid inlet opening of the base for generating a plurality of fluid streams to be expelled into the coolant flow chamber. The body further comprises a coolant return port formed within the coolant flow chamber and in communication with the fluid outlet opening of the base. |
| 公开日期 | 2019-06-13 |
| 申请日期 | 2019-02-15 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54947]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | LOCKHEED MARTIN CORPORATION |
| 推荐引用方式 GB/T 7714 | HARRIS, DANIEL W.,DITRI, JOHN,HAHN, JOSEPH W.,et al. Integration of chip level micro-fluidic cooling in chip packages for heat flux removal. US20190181071A1. 2019-06-13. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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