Optical semiconductor apparatus and method of manufacturing optical semiconductor apparatus
文献类型：专利
| 作者 | ICHINOKURA, HIROYASU; NIIZEKI, SHOICHI |
| 发表日期 | 2019-06-20 |
| 专利号 | US20190189870A1 |
| 著作权人 | NIKKISO CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Optical semiconductor apparatus and method of manufacturing optical semiconductor apparatus |
| 英文摘要 | A light emitting apparatus includes: a package substrate that includes a recess that opens on a top surface of the package substrate; a light emitting device housed in the recess; a window member provided to cover an opening of the recess; and a metal bonding part that seals a space between the package substrate and the window member. The package substrate includes a packaging surface on which the light emitting device is mounted and a metal electrode is provided, an isolation surface provided in a shape of a frame on an outer side of the packaging surface, and a light reflection surface sloping from the isolation surface toward the top surface, and a metal layer is provided on the light reflection surface with a clearance from the isolation surface. |
| 公开日期 | 2019-06-20 |
| 申请日期 | 2019-02-25 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54948]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NIKKISO CO., LTD. |
| 推荐引用方式 GB/T 7714 | ICHINOKURA, HIROYASU,NIIZEKI, SHOICHI. Optical semiconductor apparatus and method of manufacturing optical semiconductor apparatus. US20190189870A1. 2019-06-20. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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