Light emitting device, light emitting device package including the device, and lighting apparatus including the package
文献类型：专利
| 作者 | JUNG, SUNG HO; CHOI, JIN KYUNG; LEE, SANG YOUL |
| 发表日期 | 2019-07-18 |
| 专利号 | US20190221714A1 |
| 著作权人 | LG INNOTEK CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Light emitting device, light emitting device package including the device, and lighting apparatus including the package |
| 英文摘要 | A light emitting device includes a sapphire substrate; a light emitting structure disposed on the sapphire substrate, and including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer; a first electrode electrically connected to the first conductivity type semiconductor layer; a second electrode electrically connected to the second conductivity type semiconductor layer; a first bonding pad electrically connected to the first electrode; a second bonding pad electrically connected to the second electrode; a first insulation layer disposed on the light emitting structure; and a second insulation layer disposed between the second electrode and the second bonding pad. |
| 公开日期 | 2019-07-18 |
| 申请日期 | 2019-03-22 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54955]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | LG INNOTEK CO., LTD. |
| 推荐引用方式 GB/T 7714 | JUNG, SUNG HO,CHOI, JIN KYUNG,LEE, SANG YOUL. Light emitting device, light emitting device package including the device, and lighting apparatus including the package. US20190221714A1. 2019-07-18. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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