Single-chip series connected vcsel array
文献类型：专利
| 作者 | CARSON, RICHARD F.; LI, NEIN-YI; WARREN, MIAL E. |
| 发表日期 | 2019-01-31 |
| 专利号 | US20190036308A1 |
| 著作权人 | TRILUMINA CORP. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Single-chip series connected vcsel array |
| 英文摘要 | Methods, devices and systems are described for enabling a series-connected, single chip vertical-cavity surface-emitting laser (VCSEL) array. In one aspect, the single chip includes one or more non-conductive regions one the conductive layer to produce a plurality of electrically separate conductive regions. Each electrically separate region may have a plurality of VCSEL elements, including an anode region and a cathode region connected in series. The chip is connected to a sub-mount with a metallization pattern, which connects each electrically separate region on the conductive layer in series. In one aspect, the metallization pattern connects the anode region of a first electrically separate region to the cathode region of a second electrically separate region. The metallization pattern may also comprise cuts that maintain electrical separation between the anode and cathode regions on each conductive layer region, and that align with the etched regions. |
| 公开日期 | 2019-01-31 |
| 申请日期 | 2018-07-25 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/54977]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TRILUMINA CORP. |
| 推荐引用方式 GB/T 7714 | CARSON, RICHARD F.,LI, NEIN-YI,WARREN, MIAL E.. Single-chip series connected vcsel array. US20190036308A1. 2019-01-31. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。