A surface-mount compatible vcsel array
文献类型：专利
| 作者 | LI, NEIN-YI; CARSON, RICHARD, F.; WARRREN, MIAL, E. |
| 发表日期 | 2019-02-21 |
| 专利号 | WO2019036383A1 |
| 著作权人 | TRILUMINA CORP. |
| 国家 | 世界知识产权组织 |
| 文献子类 | 发明申请 |
| 其他题名 | A surface-mount compatible vcsel array |
| 英文摘要 | A VCSEL/VECSEL array design is disclosed that results in arrays that can be directly soldered to a PCB using conventional surface-mount assembly and soldering techniques for mass production. The completed VCSEL array does not need a separate package and no precision sub-mount and flip-chip bonding processes are required. The design allows for on-wafer probing of the completed arrays prior to singulation of the die from the wafer. Embodiments relate to semiconductor devices, and more particularly to multibeam arrays of semiconductor lasers for high power and high frequency applications and methods of making and using the same. |
| 公开日期 | 2019-02-21 |
| 申请日期 | 2018-08-13 |
| 状态 | 未确认 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/55028]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TRILUMINA CORP. |
| 推荐引用方式 GB/T 7714 | LI, NEIN-YI,CARSON, RICHARD, F.,WARRREN, MIAL, E.. A surface-mount compatible vcsel array. WO2019036383A1. 2019-02-21. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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