Structure light module using vertical cavity surface emitting laser array
文献类型:专利
作者 | WAN, TSUNG-WEI; CHEN, WEI-PING |
发表日期 | 2019-05-02 |
专利号 | US20190131771A1 |
著作权人 | OMNIVISION TECHNOLOGIES INC |
国家 | 美国 |
文献子类 | 发明申请 |
其他题名 | Structure light module using vertical cavity surface emitting laser array |
英文摘要 | A structure light module comprises: a VCSEL substrate comprising a VCSEL array comprising a plurality of individual VCSELs; a first spacer disposed on the VCSEL substrate; a wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the first spacer; a second spacer disposes on the wafer level lens; a DOE disposed on the second spacer, where a structure light is projected from the DOE on a target surface for 3D imaging. |
公开日期 | 2019-05-02 |
申请日期 | 2017-10-26 |
状态 | 授权 |
源URL | [http://ir.opt.ac.cn/handle/181661/55209] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | OMNIVISION TECHNOLOGIES INC |
推荐引用方式 GB/T 7714 | WAN, TSUNG-WEI,CHEN, WEI-PING. Structure light module using vertical cavity surface emitting laser array. US20190131771A1. 2019-05-02. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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