Semiconductor package and manufacturing method thereof
文献类型：专利
| 作者 | PARK, YOUNG KUK; MOON, DOO HWAN; HA, SUN HO; HAN, CHANG SUK |
| 发表日期 | 2001-06-21 |
| 专利号 | US20010004128A1 |
| 著作权人 | AMKOR TECHNOLOGY, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor package and manufacturing method thereof |
| 英文摘要 | Embodiments of a semiconductor package and manufacturing methods therefor are disclose. An exemplary package comprises an optical semiconductor chip having input and output pads on an upper surface thereof. A transparent plate is bonded to the chip via a dam located within the input and output pads. The chip is mounted within an aperture through a planar circuit board. Wires electrically connect the input and output pads to circuit patterns of the circuit board. An encapsulant fills the aperture, and supports the chip therein. Interconnects are formed on the lower surface of the circuit board. An alternative embodiment omits the dam and the wires and employs a flip chip style connection between the chip and circuit patterns on the transparent plate. The transparent is supported by and attached to the upper surface of the planar circuit board. |
| 公开日期 | 2001-06-21 |
| 申请日期 | 2000-12-11 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/56494]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AMKOR TECHNOLOGY, INC. |
| 推荐引用方式 GB/T 7714 | PARK, YOUNG KUK,MOON, DOO HWAN,HA, SUN HO,et al. Semiconductor package and manufacturing method thereof. US20010004128A1. 2001-06-21. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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