Multi stack optical elements using temporary and permanent bonding
文献类型：专利
| 作者 | GODET, LUDOVIC; MCMILLAN, WAYNE; MEYER TIMMERMAN THIJSSEN, RUTGER; ARGAMAN, NAAMAH; ROY, TAPASHREE; DOSHAY, SAGE |
| 发表日期 | 2019-10-17 |
| 专利号 | US20190318957A1 |
| 著作权人 | APPLIED MATERIALS, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Multi stack optical elements using temporary and permanent bonding |
| 英文摘要 | Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm. |
| 公开日期 | 2019-10-17 |
| 申请日期 | 2019-02-22 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/57266]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | APPLIED MATERIALS, INC. |
| 推荐引用方式 GB/T 7714 | GODET, LUDOVIC,MCMILLAN, WAYNE,MEYER TIMMERMAN THIJSSEN, RUTGER,et al. Multi stack optical elements using temporary and permanent bonding. US20190318957A1. 2019-10-17. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。