Integration of bonded optoelectronics, photonics waveguide and VLSI soi
文献类型：专利
| 作者 | BUDD, RUSSELL A.; LEOBANDUNG, EFFENDI; LI, NING ; PLOUCHART, JEAN-OLIVIER; SADANA, DEVENDRA K.
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| 发表日期 | 2017-05-04 |
| 专利号 | US20170123150A1 |
| 著作权人 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Integration of bonded optoelectronics, photonics waveguide and VLSI soi |
| 英文摘要 | An optoelectronic device includes an integrated circuit including electronic devices formed on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the semiconductor substrate. A photonics layer is formed on the barrier layer. The photonics layer includes a core for transmission of light and a cladding layer encapsulating the core and including a different index of refraction than the core. The core is configured to couple light generated from a component of the optoelectronic device. |
| 公开日期 | 2017-05-04 |
| 申请日期 | 2016-11-09 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/57509]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 推荐引用方式 GB/T 7714 | BUDD, RUSSELL A.,LEOBANDUNG, EFFENDI,LI, NING,et al. Integration of bonded optoelectronics, photonics waveguide and VLSI soi. US20170123150A1. 2017-05-04. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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