中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Dual bond pad structure for photonics

文献类型:专利

作者GAMBINO, JEFFREY P.; GRAF, RICHARD S.; LEIDY, ROBERT K.; MALING, JEFFREY C.
发表日期2017-05-04
专利号US20170125973A1
著作权人INTERNATIONAL BUSINESS MACHINES CORPORATION
国家美国
文献子类发明申请
其他题名Dual bond pad structure for photonics
英文摘要A dual bond pad structure for a wafer with laser die attachment and methods of manufacture are disclosed. The method includes forming a bonding layer on a surface of a substrate. The method further includes forming solder bumps on the bonding layer. The method further includes patterning the bonding layer to form bonding pads some of which comprise the solder bumps thereon. The method further includes attaching a laser diode to selected bonding pads using solder connections formed on the laser diode. The method further includes attaching an interposer substrate to the solder bumps formed on the bonding pads.
公开日期2017-05-04
申请日期2017-01-17
状态申请中
源URL[http://ir.opt.ac.cn/handle/181661/57542]  
专题半导体激光器专利数据库
作者单位INTERNATIONAL BUSINESS MACHINES CORPORATION
推荐引用方式
GB/T 7714
GAMBINO, JEFFREY P.,GRAF, RICHARD S.,LEIDY, ROBERT K.,et al. Dual bond pad structure for photonics. US20170125973A1. 2017-05-04.

入库方式: OAI收割

来源:西安光学精密机械研究所

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