Dual bond pad structure for photonics
文献类型：专利
| 作者 | GAMBINO, JEFFREY P.; GRAF, RICHARD S.; LEIDY, ROBERT K.; MALING, JEFFREY C. |
| 发表日期 | 2017-05-04 |
| 专利号 | US20170125973A1 |
| 著作权人 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Dual bond pad structure for photonics |
| 英文摘要 | A dual bond pad structure for a wafer with laser die attachment and methods of manufacture are disclosed. The method includes forming a bonding layer on a surface of a substrate. The method further includes forming solder bumps on the bonding layer. The method further includes patterning the bonding layer to form bonding pads some of which comprise the solder bumps thereon. The method further includes attaching a laser diode to selected bonding pads using solder connections formed on the laser diode. The method further includes attaching an interposer substrate to the solder bumps formed on the bonding pads. |
| 公开日期 | 2017-05-04 |
| 申请日期 | 2017-01-17 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/57542]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 推荐引用方式 GB/T 7714 | GAMBINO, JEFFREY P.,GRAF, RICHARD S.,LEIDY, ROBERT K.,et al. Dual bond pad structure for photonics. US20170125973A1. 2017-05-04. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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