Interfacing chip on glass assembly
文献类型：专利
| 作者 | MIZRAHI, IDAN; MACICA, STEPHEN, JOHN |
| 发表日期 | 2017-11-16 |
| 专利号 | WO2017196577A1 |
| 著作权人 | FINISAR CORPORATION |
| 国家 | 世界知识产权组织 |
| 文献子类 | 发明申请 |
| 其他题名 | Interfacing chip on glass assembly |
| 英文摘要 | In one example embodiment, an optoelectronic assembly (200) includes an electronic substrate (208), a transparent component (202) coupled on a first side of the electronic substrate, and a first component (210) which may be formed of or may include nickel plated copper coupled to a second side of the electronic substrate opposite the first side. The electronic substrate, the transparent component, and the first component may define a hermetically sealed enclosure (244). A laser array (232) or a receiver array (236) may be mechanically coupled to the transparent component inside of the enclosure and oriented to transmit or receive optical signals through the transparent component. The laser array or the receiver array may be electrically coupled to the electronic substrate. A second component (214) may be positioned between the first component and the transparent component in the hermetically sealed enclosure with a thermal interface material forming a first interface between the second component and the transparent component. |
| 公开日期 | 2017-11-16 |
| 申请日期 | 2017-05-01 |
| 状态 | 未确认 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/57577]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FINISAR CORPORATION |
| 推荐引用方式 GB/T 7714 | MIZRAHI, IDAN,MACICA, STEPHEN, JOHN. Interfacing chip on glass assembly. WO2017196577A1. 2017-11-16. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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