Die bonding apparatus and die bonding method
文献类型：专利
| 作者 | NAKAMURA, TERUYUKI; SEKINO, AKIRA; TANIGUCHI, HIDEHIRO |
| 发表日期 | 2017-12-21 |
| 专利号 | US20170365578A1 |
| 著作权人 | FURUKAWA ELECTRIC CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Die bonding apparatus and die bonding method |
| 英文摘要 | A die bonding apparatus includes: a mounting base including a mounting area on which a first member is mounted; a heater arranged below the mounting base; a side wall configured to surround the mounting area; a collet configured to hold a second member by vacuum-chucking at an end portion; a lid including a hole, the lid being mounted on the side wall; a moving structure configured to move the collet to transport the second member held by the collet through the hole for bonding the second member to the first member; and a gas-supplying tube arranged on the side wall and configured to supply a heating gas to a heating space formed by the side wall and the lid. The lid contains a material capable of: reflecting an infrared radiation caused by the heater and the heating gas; or absorbing and re-radiating the infrared radiation. |
| 公开日期 | 2017-12-21 |
| 申请日期 | 2017-06-23 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/57599]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FURUKAWA ELECTRIC CO., LTD. |
| 推荐引用方式 GB/T 7714 | NAKAMURA, TERUYUKI,SEKINO, AKIRA,TANIGUCHI, HIDEHIRO. Die bonding apparatus and die bonding method. US20170365578A1. 2017-12-21. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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