Integrating Silicon Photonics and Laser Dies using Flip-Chip Technology
文献类型：专利
| 作者 | BOURSTEIN, IDO; ROCKMAN, SYLVIE |
| 发表日期 | 2018-01-11 |
| 专利号 | US20180011248A1 |
| 著作权人 | MELLANOX TECHNOLOGIES, LTD. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Integrating Silicon Photonics and Laser Dies using Flip-Chip Technology |
| 英文摘要 | An optoelectronic device includes an optoelectronic die, a laser die, and electrical interconnects. The optoelectronic device has a surface. A trench having first and second walls and a floor is formed in the surface, and an electrically conductive layer extends from the floor, via the first wall, to the surface. The laser die includes first and second electrodes and a laser output aperture. The laser die is mounted in the trench and is configured to emit a laser beam. The first electrode is coupled to the electrically conductive layer and the laser output aperture is mechanically aligned with a waveguide that extends from the second wall. The interconnects are formed on the second electrode of the laser die and on selected locations on the surface of the optoelectronic die. The interconnects are coupled to a substrate, and are configured to conduct electrical signals between the optoelectronic die and the substrate. |
| 公开日期 | 2018-01-11 |
| 申请日期 | 2017-06-27 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/57602]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MELLANOX TECHNOLOGIES, LTD. |
| 推荐引用方式 GB/T 7714 | BOURSTEIN, IDO,ROCKMAN, SYLVIE. Integrating Silicon Photonics and Laser Dies using Flip-Chip Technology. US20180011248A1. 2018-01-11. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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