Optical sensor package including a cavity formed in an image sensor die
文献类型：专利
| 作者 | RENARD, LOIC PIERRE LOUIS; ANG, CHENG-LAY |
| 发表日期 | 2018-05-31 |
| 专利号 | US20180151772A1 |
| 著作权人 | STMICROELECTRONICS PTE LTD |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Optical sensor package including a cavity formed in an image sensor die |
| 英文摘要 | One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die. |
| 公开日期 | 2018-05-31 |
| 申请日期 | 2018-01-25 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/57688]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | STMICROELECTRONICS PTE LTD |
| 推荐引用方式 GB/T 7714 | RENARD, LOIC PIERRE LOUIS,ANG, CHENG-LAY. Optical sensor package including a cavity formed in an image sensor die. US20180151772A1. 2018-05-31. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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