Multiple laser system packaging
文献类型：专利
| 作者 | RICKMAN, ANDREW GEORGE; ABEDIASL, HOOMAN |
| 发表日期 | 2019-02-21 |
| 专利号 | WO2019034771A1 |
| 著作权人 | ROCKLEY PHOTONICS LIMITED |
| 国家 | 世界知识产权组织 |
| 文献子类 | 发明申请 |
| 其他题名 | Multiple laser system packaging |
| 英文摘要 | A photonic chip comprising tunable lasers, emitters and other optical components such as waveguides, wavelength band combiners and wavelength lockers, is packaged with one or more complementary metal-oxide semiconductor chips in different ways. The complementary metal-oxide semiconductor chips are arranged on the sides or the bottom of the photonic chip. Through-Si-vias or wire bonding provides electrical contact between the photonic chip and the complementary metal-oxide semiconductor chips. |
| 公开日期 | 2019-02-21 |
| 申请日期 | 2018-08-17 |
| 状态 | 未确认 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/57732]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ROCKLEY PHOTONICS LIMITED |
| 推荐引用方式 GB/T 7714 | RICKMAN, ANDREW GEORGE,ABEDIASL, HOOMAN. Multiple laser system packaging. WO2019034771A1. 2019-02-21. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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